REPORT ATTRIBUTE | DETAILS |
---|---|
MARKET SIZE (2032) | USD 35.23 Billion |
MARKET SIZE (2024) | USD 18.61 Billion |
CAGR (2023-2029) | 8.30% |
HISTORIC YEAR | 2019 |
BASE YEAR | 2023 |
FORECAST YEAR | 2032 |
BY TYPE | Digital Circuits Analog Circuits Hybrid Circuits |
BY APPLICATION | Speech Recognition (SR) Knowledge Graph (KG) Natural Language Processing (NLP) Computer Vision (CV) |
GEOGRAPHIC ANALYSIS | North America, Europe, Asia Pacific, Latin America, and Middle East & Africa |
KEY PLAYERS | Global Unichip Corp, Intel Corporation, Broadcom, ams OSRAM, Texas Instruments, Honeywell, Infineon Technologies, STMicroelectronics, Faraday Technology, Alchip, Elmos Semiconductor, Qualcomm, ON Semiconductor, Marvell Technology Group Ltd.. |
Introduction
ASICs are the bedrock of ingenuity and solutions in semiconductor technology. Unlike general-purpose processors, ASICs are application-scalable, efficient, effective, and customizable. This special area of the semiconductor industry facilitates an array of technologies, spanning from telecommunications and automotive to healthcare and consumer electronics.
Global Application-Specific Integrated Circuit Market Size Was Estimated At USD 18.61 Billion In 2023 And Is Projected To Reach USD 35.23 Billion By 2032, At CAGR Of 8.30% During the Forecast Period (2024-2032)
The ASIC market thrives on providing optimization and custom functionality beyond what exists in general-purpose alternatives to adequately meet the unique and stringent performance requirements of each application space. ASIC relevance is drawn from the degree of customization offered in its design compared to standard, off-the-shelf components, with critical integration capabilities into complex systems that allow them to deliver optimum performance in executing select tasks. This is an important feature because any new industry trend points toward further integration, more efficiency, and miniaturization. ASICs are playing important roles as constituents driving technology development and innovation. Good day, and welcome to this blog about the world of the ASIC market, insight into the key drivers, the challenges that the market faces, the market trend, and future prospects. We look at industries in which ASICs are having a transformational impact, competitive dynamics of the manufacturers of these chips, and ongoing implications for technological advancements over specialty semiconductors.
Market Overview:
It means that market growth is going to be fuelled by increasing demand for AI-specific integrated circuits (ASIC) for speech recognition, knowledge graph, natural language processing, computer vision, and other applications worldwide.
The report gives insights into the country-level opportunities for this market. The report also brings together an accurate overview of costs, segments, trends, regions, and business development of the prominent players of the period. The AI Application Specific Integrated Circuit ASIC Market Report represents the information gathered about industry or market for different industries. The report provides quantitative and qualitative information for a forecast period of the AI ASIC market. The report foresees a careful valuation of product, price penetration, market dynamics in the parent market, and the end application industry; fast growth trends of the market, dated yearly performance, and estimated future growth over the forecast period of the AI ASIC market will also be provided. An overview of the market, the five regions, and the key countries in this area are valuable business environment indicators that will point to the investment opportunities, the potential risks of the market, and the economy, politics, and social conditions of a country. The report is segmented in a way that it provides a comprehensive analysis of the market from every possible angle.
Market Trends:
Growing Demand for Customization
Emergence of AI and Machine Learning Applications
Advancement in Semiconductor Technology
Proliferation in the IoT domain
Growth in automotive electronics
Increasing complexity and integration needs
Emergence in power efficiency and sustainability
Shift towards design innovation and IP integration
The impact of global supply chain challenges
Regulatory and compliance requirements
Key Market Players:
Global Unichip Corp: Asia Pacific (Taiwan).
Intel Corporation: United States
Broadcom: United States
ams OSRAM: Austria, Germany
Texas Instruments: United States
Honeywell: United States
Infineon Technologies: Germany
STMicroelectronics: France, Italy
Faraday Technology: Taiwan
Alchip: Taiwan
Elmos Semiconductor: Germany
Qualcomm: United States
ON Semiconductor: United States
Marvell Technology Group Ltd.: United States
Recent Development
13 June 2024 – Today, Infineon Technologies AG received the German Brand Award in the renowned "Best of Category" as "Excellent Brands – Corporate Brand of the Year". The German Council of Design awards this to Infineon for its outstanding brand development, underlining how the company dedicates itself to creating a consistent brand image that brings perfect harmony with its corporate strategy.
April 24, 2024 – Qualcomm has announced a new processor for Windows PCs.
The Snapdragon X Plus includes the Qualcomm Oryon CPU, a dedicated integrated processor that offers 37% faster performance than other options. In response to this rising need for on-device AI-driven applications, Snapdragon X Plus provides a foundation engineered in every aspect to fulfill the demanding requirements of widespread and scalable deployment serving from edge devices up through cloud solutions using cutting-edge Qualcomm Hexagon NPU. Qualcomm has also beefed up its in-device AI on Snapdragon X Plus. By Sally Cole Johnson | August 2024Global Unichip Corp (GUC) has announced plans to work jointly with a top AI company on a next-gen Asic built for consummate machine learning apps.
Intel Corporation has announced that it launched a new range of ASICs for data centers and high-performance computing applications in July 2024. The latest chips took advantage of Intel's most advanced process technologies and were target to accelerate the calculation ability as well as cut down on power utilization in computer servers.
Broadcom- Announcing new ASIC solution now available for networking and telecommunication markets with unbelievable gains in data throughput and latency that fit growing requirements in faster, more reliable network architectures—the new ASICs June 2024.
June 2024: ams OSRAM presents the new product line of ASICs for high performance automotive lighting applications. All-new Series of ASICs for Adaptive Lighting Functions to Fully Maximize Vehicle Safety with enhanced visibility under any driving condition.
Market Drivers:
Growing demand for application-specific chips
Technological advances in semiconductor fabrication
Rising deployment of AI and machine learning applications
Increasing penetration of IoT devices
Growing demand in automotive electronics
Increased complexity and integration
Power efficiency and sustainability
Market segment diversification
Demand for High Performance Computing
Strategic Partnerships and Alliances
Market Restraint Factors
Large Initial Capital: ASIC and semiconductor fabrication facility designing and development need immense initial capital, acting as a huge entry barrier for new players and small companies.
Complexity in Design and Verification: ASICs need high-level design and design steps with rigorous verification, so the time and cost in the development are high, making deployment difficult.
Technological obsolescence: Fast progress in the semiconductor technology sector could make the product life cycle shorter and, hence, the risk of ASIC codes going obsolete if they are not continuously updated.
Global supply chain problems, semiconductor shortages, geopolitical tensions such as raw material supply chain disruptions, all could result in affecting production and the delivery timeline.
Intellectual Property Protection for IP: Today, many ASICs are developed around IP cores of company proprietary technologies. As a result, strong IP protection is needed with respect to any violation and unauthorized copying.
Key Market Opportunities:
Adoption of newer technologies — AI, ML, IoT, 5G
Customization and Differentiation
Automotive Electronics — ADAS, EVs, Connected Cars
Healthcare and Medical Devices
Industrial IoT (IIoT) and Smart Manufacturing
HPC – High Performance Computing
Security and Cryptography
Green Technology and Sustainability
Collaboration with Ecosystem partners
Key Market Insights:
Rising demand for customization: Later on demand for ASICs in the industries have been increasing, as it can be designed for the specific applications which will provide better performance.
Technological Advances: Continuous progress in the semiconductor manufacturing processes—smaller nodes, 3D integration—facilitates improved performance, lower power consumption, and provides smaller form factors for ASICs.
Scaling AI/ML: ASICs have critical acceleration properties in the implementation of AI and ML workloads, driving even higher demand for purpose-built and optimally architected ASICs that target NNs, deep learning algorithms, and AI inference.
Automotive Electronics: The advancements in automotive electronics have used ASICs to maintain these advanced notifications of ADAS, vehicle electrification, and autonomous driving technology.
Market segmentation:
Type
Standard ASICs: Simple applications of multi-purpose and general applications.
Custom ASICs: To serve a specific purpose and to provide a very high standard performance.
Semi-Custom ASICs: This type is partially customizable. In that sense, it is very similar to FPGAs.
Technology
Digital ASICs: Applicable for digital processing and logic.
Analog ASICs: Normally used for continuous signals. Example: audio and power management.
Mixed-Signal ASICs: We combine our customers' digital and analog functions on the same chip.
Application
Electronics: Smartphones, Tablets.
Automotive: ADAS, infotainment, ECUs.
Telecommunications: Network infrastructure, base stations.
Industrial: Automation, robotics.
Healthcare: Medical devices, diagnostics.
Defense and Aerospace: Satellites, radar systems.
By Region
North America: Leader in innovation and technology.
Europe: Emphasizes on safety and regulation.
Asia-Pacific: Super growing market for consumer electronics and automotive.
Latin America: Electronics and Automotive are emerging markets.
Middle East and Africa: Infrastructure and telecommunications.
Emerging Trends
Growth in Custom ASIC: Growing need for specialized solutions.
Advanced Technology: Smaller process nodes for better performance.
AI Integration — ASICs supporting AI and machine learning.
Energy Efficiency: Focus on power-efficient architectures.
The following stakeholders will be associated with the application-specific integrated circuit market:
ASIC Manufacturers
Semiconductor Foundries
Technology Providers
End-Users Industry Sectors
System Integrators
Research Institutions
Industry Associations
Regulatory Bodies
Frequently asked questions:
Q.1 What is size of the Application-Specific Integrated Circuit Market?
Ans: - Application-Specific Integrated Circuit Market Size Was US$ 18.61 Billion in 2023 and is Anticipated to reach US$ 35.23 Billion by 2032, At CAGR Of 8.30%.
Q. 2 Key Players in the Global Application-Specific Integrated Circuit Industry?
Answer :- Top Companies : Global Unichip Corp, Intel Corporation, Broadcom, ams OSRAM, OncQue Corporations Inc., Texas Instruments and Honeywell Infineon Technologies AG STMicroelectronics NV Faraday Technology Pte Alchip Elmos Semiconductor SE Qualcomm Tribocom LLC ON Semiconductor Marvell Technology Group Ltd.
Q. 3 Mention the regions covered: Application-Specific Integrated Circuit Market?
Answer :- The Application-Specific Integrated Circuit Market Is Segmented On The Basis Of Type, Application And Geography.
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